Abstract
With compact footprint, low energy consumption, high scalability, and
mass producibility, chip-scale integrated devices are an indispensable
part of modern technological change and development. Recent advances
intwo-dimensional (2D) layered materials with their unique structures
and distinctive properties have motivated their on-chip integration,
yielding a variety of functional devices with superior performance and
new features. To realize integrated devices incorporating 2D materials,
it requires a diverse range of device fabrication techniques, which are
of fundamental importance to achieve good performance and high
reproducibility. This paper reviews the state-of-art fabrication
techniques for the on-chip integration of 2D materials. First, an
overview of the material properties and on-chip applications of 2D
materials is provided. Second, different approaches used for integrating
2D materials on chips are comprehensively reviewed, which are
categorized into material synthesis, on-chip transfer, film patterning,
and property tuning / modification. Third, the methods for integrating
2D van der Waals heterostructures are also discussed and summarized.
Finally, the current challenges and future perspectives are highlighted.