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Drying mechanism of monodisperse colloidal film: Evolution of normal stress and its correlation with microstructure
  • Young Ki Lee,
  • Kyung Ahn
Seoul National University

Corresponding Author:[email protected]

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Young Ki Lee
Seoul National University
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Kyung Ahn
Seoul National University
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We investigate the drying process of monodisperse colloidal film over a wide range of Péclet number (Pe) by using the Brownian dynamics simulation. We analyze the detailed process in three aspects; accumulation front, normal stress, and microstructure. The evolution of particle distribution is quantified by tracking the accumulation front. The accumulated particles contribute to the continuous increase of the normal stress at the interface. At the substrate, the normal stress first stays constant and then increases as the accumulation front touches the substrate. We quantitatively analyze the stress development by a scaled normal stress difference between the two boundaries. At all tested Pe, the stress difference increases to the maximum, followed by a decrease during drying. Interestingly, a mismatch is observed between the stress difference maximum and the initial stress increase at the substrate. The microstructural analysis reveals that this mismatch is related to the microstructural development at the substrate.
01 Mar 2021Submitted to AIChE Journal
03 Mar 2021Submission Checks Completed
03 Mar 2021Assigned to Editor
12 Mar 2021Reviewer(s) Assigned
18 May 2021Editorial Decision: Revise Minor
01 Jun 20211st Revision Received
08 Jun 2021Submission Checks Completed
08 Jun 2021Assigned to Editor
16 Jun 2021Reviewer(s) Assigned
03 Aug 2021Editorial Decision: Accept
19 Aug 2021Published in AIChE Journal. 10.1002/aic.17400