Device fabrication
The upper and lower layers of the chip were designed using SolidWorks
software and sent to Shenzhen Future Factory for mold production and
injection molding. After chip cleaning, the ultra-thin double-sided
adhesive was precisely cut into the defined shape and then being used to
securely encapsulate a polyethylene PET film between the upper and lower
layers of the chip in a controlled dust-free environment. The PET film
had a thickness of 10 μm and a pore size of 2 μm. To ensure the sterile
conditions for cell culture, the assembled chips underwent overnight UV
irradiation and additionally treated with a 5% PS solution for a
minimum of 4 hours before being utilized. The specific chip size can be
obtained in fig. S1.