Device fabrication
The upper and lower layers of the chip were designed using SolidWorks software and sent to Shenzhen Future Factory for mold production and injection molding. After chip cleaning, the ultra-thin double-sided adhesive was precisely cut into the defined shape and then being used to securely encapsulate a polyethylene PET film between the upper and lower layers of the chip in a controlled dust-free environment. The PET film had a thickness of 10 μm and a pore size of 2 μm. To ensure the sterile conditions for cell culture, the assembled chips underwent overnight UV irradiation and additionally treated with a 5% PS solution for a minimum of 4 hours before being utilized. The specific chip size can be obtained in fig. S1.